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  See Details Please
Semiconductor Assembly Related Items:
Back Grinding Process Items
Back Grinding Tape Mounter - Manual
Back Grinding Tape Mounter - Semi-Auto
Back Grinding Tape Remover - Semi-Auto
Precut Tape Applicator - Semi-Auto
Dicing Process Related Items
Dicing Tapes - All Types
Tape Mounter - Manual
Tape Mounter - Semi Auto
Dicing Blades
Wafer Expander
Grip-Rings
UV Exposure System
UV Dry Cleaning System
Static Electricity Removing Items:
Comprehensive Catalog Page
Ionizer Air Gun
Ionizer Air Nozzle
DC Ion Blower
Compact Static Electricity Digital Measuring Tester.
Inline type Air Nozzles
Ionizer of various types
Mounting/Inspection Process Related Items:
Wire Pull Tester
Ball Shear Tester
Wire Pull Tester (simple type)
CCD Cameras, LED illuminated Inspection Microscopes,
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SEMI-TECH, INC.
Established:
February, 1998 (privately-owned corporation)
President:
Akira Nishikawa
Business:
Semiconductor production equipment and
materials sales/service,
customer support, for Japanese and overseas market.
Import/Export Related items.
Address:
13-18 Saiwai-cho, Chigasaki-shi, Kanagawa,
243-0052, Japan.
Phone: 0467-59-4321
Fax: 0467-59-4318
E-mail:
inform@semitech.co.jp
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Company mainly focuses to Test & Assembly segment of semiconductor process area, to both Japan and to Southeast Asian countries.
Items are aimed to provide increasing production efficiency such as gaining yield, reliability, safety, cost effectiveness, and space savings.
High accuracy, longer life of dicing blades for various substrate materials are welcomed by users. Various tapes such as standard PVC to strong adhesion UV tapes for both Back- Grinding and Dicings are handled and developed to meet all demanding needs.
We also provide wire pull tester for wire-bonded chips. This Pull-Tester is one of kind you won't see from other suppliers in the market.
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Participated 2007 Inter Nepcon, Japan. Tokyo.
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